switches - chip 4 4 - 2 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com HMC232 gaas mmic spdt non-reflective switch, dc - 15 ghz v03.1203 general description features functional diagram the HMC232 is a broadband non-refl ective gaas mesfet spdt mmic chip. covering dc to 15 ghz, the switch features over 55 db isolation at lower frequencies and over 45 db at higher frequencies due to the implementation of on-chip via hole structures. the switch operates using two negative control voltage logic lines (a&b) of -5/0v and requires no vee. alternate a & b control pads are provided to ease mic implementation. all data shown is tested with the chip in a 50 ohm test fi xture connected via 0.025 mm (1 mil) diameter wire bonds of 0.5 mm (20 mils) length. this product is a form, fi t & functional replacement for the hmc132. high isolation: >50 db @ 10 ghz low insertion loss: 1.4 db @ 6 ghz non-refl ective design die size: 2.05 x 1.04 x 0.1 mm direct replacement for hmc132 electrical specifi cations, t a = +25 c, with 0/-5v control, 50 ohm system typical applications broadband switch for dc - 15 ghz applications: ? fiber optics ? microwave radio ? military & space ? test equipment ? vsat parameter frequency min. typ. max. units insertion loss dc - 6 ghz dc - 10 ghz dc - 15 ghz 1.4 2.2 3.1 1.7 2.5 3.4 db db db isolation dc - 6 ghz dc - 10 ghz dc - 15 ghz 50 45 40 55 50 45 db db db return loss on state dc - 6 ghz dc - 15 ghz 18 12 db db return loss rf1, rf2 off state dc - 6 ghz dc - 15 ghz 14 13 db db input power for 1 db compression 0.5 - 15 ghz 21 26 dbm input third order intercept (two-tone input power= +7 dbm each tone, 1 mhz tone separation) 0.5 - 15 ghz 44 49 dbm switching characteristics trise, tfall (10/90% rf) ton, toff (50% ctl to 10/90% rf) dc - 15 ghz 3 5 ns ns
switches - chip 4 4 - 3 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com input third order intercept point return loss 0.1 and 1 db input compression point insertion loss vs. temperature isolation -6 -5 -4 -3 -2 -1 0 0246810121416 +25 c +85 c -55 c insertion loss (db) frequency (ghz) -90 -75 -60 -45 -30 -15 0 0246810121416 rf1 rf2 isolation (db) frequency (ghz) -25 -20 -15 -10 -5 0 0246810121416 rfc rf1, rf2 on rf1, rf2 off return loss (db) frequency (ghz) 10 15 20 25 30 0246810121416 0.1 db compression point 1 db compression point p1db (dbm) frequency (ghz) 30 35 40 45 50 55 60 0246810121416 +25 c +85 c -55 c ip3 (dbm) frequency (ghz) HMC232 v03.0907 gaas mmic spdt non-reflective switch, dc - 15 ghz
switches - chip 4 4 - 4 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com truth table absolute maximum ratings control voltages outline drawing control input signal path state a b rfc to rf1 rfc to rf2 high low on off low high off on state bias condition low 0 to -0.2v @ 10 ua max. high -5v @ 10 ua typ. to -7v @ 45 ua typ. rf input power (vctl = -5v) (0.5 - 15 ghz) +30 dbm (@ +50 c) control voltage range (a & b) +1 v to -7.5 vdc channel temperature 150 c thermal resistance 92 c/w storage temperature -65 to +150 c operating temperature -55 to +85 c esd sensitivity (hbm) class 1a notes: 1. all dimensions in inches [millimeters] 2. bond pads are 0.004 square 3. typical bond pad spacing center to center is .006 4. backside metalization: gold 5. bond pad metalization: gold 6. backside of die is ground 7. die thickness is .004 8. no connection required for unlabled bond pads caution: do not hot switch power levels greater than +26 dbm (vctl = 0/-5 vdc). die packaging information [1] standard alternate wp-17 (waffle pack) [2] [1] refer to the packaging information section for die packaging dimensions. [2] for alternate packaging information contact hittite microwave corporation. electrostatic sensitive device observe handling precautions HMC232 v03.0907 gaas mmic spdt non-reflective switch, dc - 15 ghz
switches - chip 4 4 - 5 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com pad number function description interface schematic 2, 5, 8, 10 a see truth table and control voltage table. alternate a & b control pads provided. 3, 6, 9 b see truth table and control voltage table. alternate a & b control pads provided. 1, 4, 7 rf1, rfc, rf2 this pad is dc coupled and matched to 50 ohms. blocking capacitors are required if the rf line potential is not equal to 0v. gnd die bottom must be connected to rf ground. pad descriptions suggested driver circuit HMC232 v03.0907 gaas mmic spdt non-reflective switch, dc - 15 ghz
switches - chip 4 4 - 6 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com assembly diagram HMC232 v03.0907 gaas mmic spdt non-reflective switch, dc - 15 ghz
switches - chip 4 4 - 7 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm microstrip transmission lines on 0.127mm (5 mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. typical die-to-substrate spacing is 0.076mm (3 mils). handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waffle or gel based esd protective containers, and then sealed in an esd protective bag for shipment. once the sealed esd protective bag has been opened, all die should be stored in a dry nitrogen environment. cleanliness: handle the chips in a clean environment. do not attempt to clean the chip using liquid cleaning systems. static sensitivity: follow esd precautions to protect against esd strikes. transients: suppress instrument and bias supply transients while bias is applied. use shielded signal and bias cables to minimize inductive pick-up. general handling: handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. the surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fi ngers. mounting the chip is back-metallized and can be die mounted with ausn eutectic preforms or with electrically conductive epoxy. the mounting surface should be clean and fl at. epoxy die attach: apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fi llet is observed around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturers schedule. wire bonding ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire (dc bias, if1 and if2) or ribbon bond (rf and lo ports) 0.076 mm x 0.013 mm (3 mil x 0.5 mil) size is recommended. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. use the minimum level of ultra - sonic energy to achieve reliable wirebonds. wirebonds should be started on the chip and terminated on the package or substrate . all bonds should be as short as possible <0.31 mm (12 mils). 0.102mm (0.004?) thick gaas mmic wire bond rf ground plane 0.254mm (0.010?) thick alumina thin film substrate 0.076mm (0.003?) figure 2. 0.150mm (0.005?) thick moly tab 0.102mm (0.004?) thick gaas mmic wire bond rf ground plane 0.127mm (0.005?) thick alumina thin film substrate 0.076mm (0.003?) figure 1. HMC232 v03.0907 gaas mmic spdt non-reflective switch, dc - 15 ghz
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